Light-emitting device with a long lifespan

ABSTRACT

A light-emitting device includes a housing, a light-emitting unit, a cup-shaped reflector, and a plurality of leads. The light-emitting unit is disposed in the housing. The cup-shaped reflector is disposed in the housing, and includes a base wall that is formed with a plurality of holes therethrough, and a surrounding wall that diverges from the base wall thereof and that surrounds the light-emitting unit. Each of the leads extends into the housing and is coupled electrically to the light-emitting unit.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims priority of Taiwanese application no. 095150104,filed on Dec. 28, 2006.

BACKGROUND OF THE INVENTION

1. Field of the Invention

This invention relates to a light-emitting device, more particularly toa light-emitting device capable of efficiently dissipating heatgenerated thereby.

2. Description of the Related Art

A conventional light-emitting device generates a large amount of heat,which causes rapid deterioration in the brightness thereof.

SUMMARY OF THE INVENTION

Therefore, the object of the present invention is to provide alight-emitting device that overcomes the aforesaid drawback of the priorart.

According to one aspect of the present invention, a light-emittingdevice comprises a housing, a light-emitting unit, a cup-shapedreflector, and a plurality of leads. The housing includes complementaryfirst and second housing parts that cooperatively define anaccommodating space therebetween. The light-emitting unit is disposed inthe accommodating space in the housing, and includes at least onelight-emitting chip that has a plurality of conductive contacts. Thecup-shaped reflector is disposed in the accommodating space in thehousing and is mounted on the first housing part for reflecting lightemitted from the light-emitting chip of the light-emitting unit towardthe second housing part. The cup-shaped reflector includes a base wallthat is formed with a plurality of holes therethrough, and a surroundingwall that diverges from the base wall thereof and that surrounds thelight-emitting unit. Each of the leads extends into the accommodatingspace in the housing, and is coupled electrically to a respective one ofthe conductive contacts of the light-emitting chip of the light-emittingunit.

According to another aspect of the present invention, a light-emittingdevice comprises first and second light-transmissible substrates, aplurality of electrical contacts, a light-emitting unit, a couplingunit, and a heat-dissipating unit. The first and secondlight-transmissible substrates cooperatively define an accommodatingspace. Each of the electrical contacts is disposed in the accommodatingspace. The light-emitting unit is disposed in the accommodating space,and includes at least one light-emitting chip that has a plurality ofconductive contacts, each of which is coupled electrically to arespective one of the electrical contacts. The coupling unit is coupledelectrically to the electrical contacts and adapted to be coupledelectrically to a power source. The heat-dissipating unit includes atleast one thermally conductive element. The thermally conductive elementhas a first end portion that is disposed in the accommodating space, anda second end portion that extends externally of the accommodating space.

BRIEF DESCRIPTION OF THE DRAWINGS

Other features and advantages of the present invention will becomeapparent in the following detailed description of the preferredembodiments with reference to the accompanying drawings, of which:

FIG. 1 is a fragmentary partly sectional view of the first preferredembodiment of a light-emitting device according to this invention;

FIG. 2 is a perspective view of the first preferred embodiment;

FIG. 3 is a perspective view of the second preferred embodiment of alight-emitting device according to this invention;

FIG. 4 is a schematic view to illustrate an exemplary application of thesecond preferred embodiment;

FIG. 5 is a fragmentary partly sectional view of the third preferredembodiment of a light-emitting device according to this invention;

FIG. 6 is a perspective view of the third preferred embodiment;

FIG. 7 is a perspective view of the fourth preferred embodiment of alight-emitting device according to this invention;

FIG. 8 is a fragmentary partly sectional view of the fifth preferredembodiment of a light-emitting device according to this invention;

FIG. 9 is a fragmentary partly sectional view of the sixth preferredembodiment of a light-emitting device according to this invention;

FIG. 10 is a fragmentary partly sectional view of the seventh preferredembodiment of a light-emitting device according to this invention;

FIG. 11 is a fragmentary partly sectional view illustrating alight-transmissible substrate, a pair of leads, a pair of electricalcontacts, and a pair of light-emitting chips of the eighth preferredembodiment of a light-emitting device according to this invention;

FIG. 12 is a fragmentary partly sectional view of the ninth preferredembodiment of a light-emitting device according to this invention;

FIG. 13 is a schematic view illustrating a light-transmissiblesubstrate, a pair of electrical contacts, and a pair of light-emittingchips of the tenth preferred embodiment of a light-emitting deviceaccording to this invention;

FIG. 14 is a schematic view illustrating a light-transmissiblesubstrate, a pair of electrical contacts, and two pairs oflight-emitting chips of the eleventh preferred embodiment of alight-emitting device according to this invention;

FIG. 15 is a schematic view illustrating a light-transmissiblesubstrate, a pair of electrical contacts, and four pairs oflight-emitting chips of the twelfth preferred embodiment of alight-emitting device according to this invention;

FIG. 16 is a fragmentary partly sectional view of the thirteenthpreferred embodiment of a light-emitting device according to thisinvention;

FIG. 17 is a fragmentary partly sectional view of the fourteenthpreferred embodiment of a light-emitting device according to thisinvention;

FIG. 18 is a partly sectional view of the fifteenth preferred embodimentof a light-emitting device according to this invention;

FIG. 19 is a partly sectional view illustrating a heat-dissipating unitof the fifteenth preferred embodiment;

FIG. 20 is a circuit block diagram illustrating an alternating currentto direct current converter of the fifteenth preferred embodiment;

FIG. 21 is a partly sectional view of the sixteenth preferred embodimentof a light-emitting device according to this invention;

FIG. 22 is a partly sectional view illustrating a heat-dissipating unitof the sixteenth preferred embodiment;

FIG. 23 is a partly sectional view of the seventeenth preferredembodiment of a light-emitting device according to this invention;

FIG. 24 is a partly sectional view illustrating a bulb housing and ascrew base of the seventeenth preferred embodiment;

FIG. 25 is a partly sectional view of the eighteenth preferredembodiment of a light-emitting device according to this invention;

FIG. 26 is a partly sectional view illustrating a tubular housing and apair of pins of the eighteenth preferred embodiment;

FIG. 27 is a partly sectional view of the nineteenth preferredembodiment of a light-emitting device according to this invention;

FIG. 28 is a partly sectional view illustrating a heat-dissipating unitof the nineteenth preferred embodiment;

FIG. 29 is a partly sectional view of the twentieth preferred embodimentof a light-emitting device according to this invention; and

FIG. 30 is a partly sectional view illustrating a circuit board of thetwentieth preferred embodiment.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Before the present invention is described in greater detail, it shouldbe noted that like elements are denoted by the same reference numeralsthroughout the disclosure.

Referring to FIG. 1, the first preferred embodiment of a light-emittingdevice 100 according to this invention is shown to include a housing 1,a light-emitting unit 31, a cup-shaped reflector 2, and a pair of leads32.

The housing 1 includes complementary first and second housing parts 11,12 that cooperatively define an accommodating space 10 therebetween. Inthis embodiment, the housing 1 is generally spherical in shape, asillustrated in FIG. 2.

The light-emitting device 100 further includes a mounting unit 3 that isdisposed in the accommodating space 10 in the housing 1, and thatincludes a light-transmissible substrate 30, a pair of electricalcontacts 301, and a pair of conductive wires 33. The light-transmissiblesubstrate 30 has opposite first and second mounting surfaces 300, 302.Each of the electrical contacts 301 is mounted on the first mountingsurface 300 of the light-transmissible substrate 30. In this embodiment,each of the electrical contacts 301 is made from an indium tin oxidematerial or an indium zinc oxide material.

The light-emitting unit 31 is disposed in the accommodating space 10 inthe housing 1 and includes a light-emitting chip 311 mounted on thefirst mounting surface 300 of the light-transmissible substrate 30. Inthis embodiment, the light-emitting chip 311 has opposite first andsecond mounting surfaces 312, 316, and a pair of conductive contacts 310mounted on the first mounting surface 312 thereof. In addition, thelight-emitting chip 311 of the light-emitting unit 31 is one of alight-emitting diode chip, and a laser diode chip. Preferably, thelight-emitting chip 311 of the light-emitting unit 31 emits one of a redlight, a green light, and a blue light.

The cup-shaped reflector 2 is disposed in the accommodating space 10 inthe housing 1 and is mounted on the first housing part 11 of the housing1 for reflecting light emitted from the light-emitting chip 311 of thelight-emitting unit 31 toward the second housing part 12. In particular,the cup-shaped reflector 2 includes a base wall 21, and a surroundingwall 22 that diverges from the base wall 21 and that surrounds thelight-emitting unit 31.

It is noted that each of the first mounting surface 300 of thelight-transmissible substrate 30 and the first mounting surface 312 ofthe light-emitting chip 311 of the light-emitting unit 31 faces andextends parallel to the base wall 21 of the cup-shaped reflector 2. Thebase wall 21 of the cup-shaped reflector 2 is formed with a plurality ofholes 20 therethrough. The construction as such permits air to circulatebetween the cup-shaped reflector 2 and the housing 1 to thereby reduceheat generated by the light-emitting chip 311 of the light-emitting unit31.

Each of the conductive wires 33 of the mounting unit 3 interconnects arespective one of the electrical contacts 301 to a respective one of theconductive contacts 310 of the light-emitting chip 311 of thelight-emitting unit 31.

The cup-shaped reflector 2 has an inner surface coated with a firstfluorescent layer 4. In this embodiment, the first fluorescent layer 4generates light of a wavelength in one of ranges from 400 nm to 470 nm,from 500 nm to 560 nm, from 600 nm to 620 nm, and from 250 nm to 380 nmwhen excited by light generated by the light-emitting chip 311 of thelight-emitting unit 31.

In an alternative embodiment, the housing 1 may be coated with the firstfluorescent layer 4.

Each of the leads 32 extends into the accommodating space 10 in thehousing 1, and is connected electrically and directly to a respectiveone of the electrical contacts 301.

FIG. 3 illustrates the second preferred embodiment of a light-emittingdevice 100 according to this invention. When compared to the firstpreferred embodiment, the housing 1 is generally cylindrical in shape.The construction as such permits application of the light-emittingdevice 100 of this embodiment to backlight module devices 200, asillustrated in FIG. 4.

FIGS. 5 and 6 illustrate the third preferred embodiment of alight-emitting device 100 according to this invention. When compared tothe first preferred embodiment, each of the first mounting surface 300of the light-transmissible substrate 30 and the first mounting surface312 of the light-emitting chip 311 of the light-emitting unit 31 extendstransversely to the base wall 21 of the cup-shaped reflector 2.

The light-emitting device 100 further includes a non-conductive coolant83 contained in the accommodating space 10 in the housing 1. As such,the heat generated by the light-emitting unit 31 is conducted throughthe non-conductive coolant 83 to the first housing part 11 of thehousing 1 via the holes 20.

In this embodiment, the non-conductive coolant 83 is mixed withfluorescent powder, and an anti-precipitant agent for preventingprecipitation of the fluorescent powder.

FIG. 7 illustrates the fourth preferred embodiment of a light-emittingdevice 100 according to this invention. When compared to the thirdpreferred embodiment, the housing 1 is generally cylindrical in shape.

FIG. 8 illustrates the fifth preferred embodiment of a light-emittingdevice 100 according to this invention. When compared to the firstpreferred embodiment, the light-emitting chip 311 of the light-emittingunit 31 is a flip chip, and includes a sapphire substrate 313 mounted onthe first mounting surface 312 thereof. The conductive contacts 310 ofthe light-emitting chip 311 of the light-emitting unit 31 are mounted onthe second mounting surface 316 thereof.

In this embodiment, the sapphire substrate 313 is formed with first andsecond V-shaped grooves 314 to thereby increase reflective efficiencythereof. Preferably, each of the V-shaped grooves 314 is defined by apair of walls with different lengths.

FIG. 9 illustrates the sixth preferred embodiment of a light-emittingdevice 100 according to this invention, when compared to the fifthpreferred embodiment, each of the first mounting surface 300 of thelight-transmissible substrate 30 and the first mounting surface 312 ofthe light-emitting chip 311 of the light-emitting unit 31 extendstransversely to the base wall 21 of the cup-shaped reflector 2.

In this embodiment, the sapphire substrate 313 is further formed with athird V-shaped groove 315 that is disposed between the first and secondV-shaped grooves 314. Preferably, the third V-shaped groove 315 isdefined by a pair of walls with the same lengths.

FIG. 10 illustrates the seventh preferred embodiment of a light-emittingdevice 100 according to this invention. When compared to the firstpreferred embodiment, the light-emitting unit 31 includes two of thelight-emitting chips 311 coupled electrically to each other. The innersurface of the cup-shaped reflector 2 is further coated with a secondfluorescent layer 6, which has a wavelength different from that of thefirst fluorescent layer 4. Each of the first and second fluorescentlayers 4, 6 emits light of a wavelength in one of ranges from 400 nm to470 nm, from 500 nm to 560 nm, from 600 nm to 620 nm, and from 250 nm to380 nm when excited by the light generated by the light-emitting chips311 of the light-emitting unit 31.

FIG. 11 illustrates the eight preferred embodiment of a light-emittingdevice 100 according to this invention. When compared to the firstpreferred embodiment, the light-emitting unit 31 includes a pair of thelight-emitting chips 311, each of which is mounted on a respective oneof the first and second mounting surfaces 300, 302 of thelight-transmissible substrate 30.

FIG. 12 illustrates the ninth preferred embodiment of a light-emittingdevice 100 according to this invention. When compared to the firstpreferred embodiment, the mounting unit 3 (see FIG. 1) is dispensedwith, and each of the leads 32 is connected directly and electrically toa respective one of the conductive contacts 310 of the light-emittingchip 311 of the light-emitting unit 31.

The light-emitting device 100 of this embodiment further includes atransparent adhesive material 36 provided at a junction of a respectiveone of the leads 32 and a respective one of the conductive contacts 310of the light-emitting chip 311 of the light-emitting unit 31.

FIG. 13 illustrates the tenth preferred embodiment of a light-emittingdevice 100 according to this invention. When compared to the firstpreferred embodiment, the light-emitting unit 31 includes a pair of thelight-emitting chips 311. The first mounting surface 312 of each of thelight-emitting chips 311 of the light-emitting unit 31 extendstransversely to the base wall 21 of the cup-shaped reflector 2 (see FIG.1).

FIG. 14 illustrates the eleventh preferred embodiment of alight-emitting device 100 according to this invention. When compared tothe first preferred embodiment, the light-emitting unit 31 includes fourof the light-emitting chips 311 that are equiangularly displaced. Thefirst mounting surface 312 of each of the light-emitting chips 311 ofthe light-emitting unit 31 extends transversely to the base wall 21 ofthe cup-shaped reflector 2 (see FIG. 1).

FIG. 15 illustrates the twelfth preferred embodiment of a light-emittingdevice 100 according to this invention. When compared to the firstpreferred embodiment, the light-emitting unit 31 includes eight of thelight-emitting chips 311 that are equiangularly displaced. The firstmounting surface 312 of each of the light-emitting chips 311 of thelight-emitting unit 31 extends transversely to the base wall 21 of thecup-shaped reflector 2 (see FIG. 1).

FIG. 16 illustrates the thirteenth preferred embodiment of alight-emitting device 100 according to this invention. When compared tothe first preferred embodiment, the light-emitting device 100 furtherincludes a heat-dissipating unit 8 for dissipating heat generated by thelight-emitting unit 31. In this embodiment, the heat-dissipating device8 includes a thermally conductive base 80 and a plurality of thermallyconductive fins 81. The thermally conductive base 80 is disposedexternally of the housing 1, and is mounted on and in contact with thefirst housing part 11 of the housing 1. Each of the thermally conductivefins 81 is disposed externally of the housing 1 and extends from thethermally conductive base 80. As such, the heat generated by thelight-emitting unit 31 is conducted through the housing 1, and istransferred to the thermally conductive base 80 and eventually to thethermally conductive fins 81 for dissipation therefrom.

In an alternative embodiment, the light-emitting device 100 furtherincludes a non-conductive coolant (not shown) contained in theaccommodating space 10 in the housing 1. As such, the heat generated bythe light-emitting unit 31 is conducted through the non-conductivecoolant 83 and the housing 1, and is transferred to the thermallyconductive base 80 and eventually to the thermally conductive fins 81for dissipation therefrom.

FIG. 17 illustrates the fourteenth preferred embodiment of alight-emitting device 100 according to this invention. When compared tothe thirteenth embodiment, the thermally conductive base 80 and thethermally conductive fins 81 of the heat-dissipating unit 8 is disposedexternally of the housing 1 and in such a manner that the thermallyconductive base 80 and the thermally conductive fins 81 are spaced apartfrom the housing 1. The heat-dissipating unit 8 further includes a pairof thermally conductive elements 82, each of which extends from thethermally conductive base 80 thereof into the accommodating space 10 inthe housing 1 through the first housing part 11 and the cup-shapedreflector 2. As such, the heat generated by the light-emitting unit 31is conducted through the thermally conductive elements 82, and istransferred to the thermally conductive base 80 and eventually to thethermally conductive fins 81 for dissipation therefrom.

Referring to FIGS. 18 and 19, the fifteenth preferred embodiment of alight-emitting device 100 according to this invention includes first andsecond light-transmissible substrates 90, 91, a plurality of pairs ofelectrical contacts 301, a plurality of light-emitting units 31, acoupling unit 38, and a heat-dissipating unit 8.

Since the pairs of the electrical contacts 301 are identical instructure, only one of the pairs of the electrical contacts 301 will bedescribed herein.

The first and second light-transmissible substrates 90, 91 cooperativelydefine an accommodating space 10 therebetween. In this embodiment, thefirst and second transmissible substrates 90, 91 are attached to eachother with the use of a transparent adhesive material 910.

Each of the electrical contacts 301 is disposed in the accommodatingspace 10 and is mounted on an inner surface of the firstlight-transmissible substrate 90. In this embodiment, each of theelectrical contacts 301 is made from an indium tin oxide material or anindium zinc oxide material.

The light-emitting unit 31 is disposed in the accommodating space 10, ismounted on the inner surface of the first transmissible substrate 90,and includes a plurality of light-emitting chips 311, each of which haspair of conductive contacts 310. In this embodiment, each of thelight-emitting chips 311 of the light-emitting unit 31 is one of alight-emitting diode chip and a laser diode chip. Preferably, each ofthe light-emitting chips 311 of the light-emitting unit 31 emits one ofa red light, a green light, and a blue light.

Since the light-emitting chips 311 are identical in structure, only oneof the light-emitting chips 311 will be described herein.

The light-emitting device 100 further includes a pair of leads 32, eachof which has first and second end portions 321, 322. The first endportion 321 of each of the leads 32 is disposed in the accommodatingspace 10, is connected electrically to a respective one of theelectrical contacts 301 and a respective one of the conductive contacts310 of the light-emitting chip 311 of the light-emitting unit 31. Thesecond end portion 322 of each of the leads 32 extends externally of theaccommodating space 10.

The light-emitting device 100 further includes an alternating current todirect current (ac-to-dc) converter 37 that has input and output sides.The output side of the ac-to-dc converter 37 is connected electricallyto the second end portions 322 of the leads 32.

The coupling unit 38 is disposed externally of the accommodating space10, is connected electrically to the input side of the ac-to-dcconverter 37, and is adapted to be coupled electrically to an ac powersource (AC).

With further reference to FIG. 20, the light-emitting device 100 furtherincludes a transistor (T) and an oscillator (OSC). The transistor (T)has an emitter (E) and a collector (C) connected electrically to theac-to-dc converter 38, and a base (B) connected electrically to theoscillator (OSC). Each of the conductive contacts 310 of thelight-emitting chip 311 of the light-emitting unit 31 is connectedelectrically to a respective one of the collector (C) of the transistor(T) and the oscillator (OSC).

In operation, when the oscillator (OSC) generates electricaloscillations, the transistor (T) is turned off and on alternately tothereby cause the light-emitting chip 311 of the light-emitting unit 31to emit light intermittently.

The heat-dissipating unit 8 serves to dissipate heat generated by thelight-emitting chip 311 of the light-emitting unit 31. In particular,the heat-dissipating unit 8 includes a pair of thermally conductivebases 80, a pair of thermally conductive fin units 81, and a pair ofthermally conductive elements 82. Each of the thermally conductive bases80 is disposed externally of the accommodating space 10. Each of thethermally conductive fin units 81 includes a plurality of fins, isdisposed externally of the accommodating space 10, and extends from arespective one of the thermally conductive bases 80 Each of thethermally conductive elements 82 has a first end portion 821 that isdisposed in the accommodating space 10, and a second end portion 822that extends externally of the accommodating space 10 and that isconnected to a respective one of the thermally conductive bases 80.

The light-emitting device 100 further includes a non-conductive coolant83 contained in the accommodating space 10. As such, the heat generatedby the light-emitting unit 31 is conducted through the non-conductivecoolant 83 and the thermally conductive elements 82, and is transferredto the thermally conductive bases 80 and eventually to the thermallyconductive fin units 81 for dissipation therefrom.

In an alternative embodiment, the non-conductive coolant 83 is mixedwith fluorescent powder, and an anti-precipitant agent for preventingprecipitation of the fluorescent powder.

The light-emitting device 100 further includes a fluorescent layer 4coated on outer surfaces of the first and second light-transmissiblesubstrates 90, 91.

The fluorescent layer generates light of a wavelength in one of rangesfrom 400 nm to 470 nm, from 500 nm to 560 nm, from 600 nm to 620 nm, andfrom 250 nm to 380 nm when excited by the light generated by thelight-emitting chip 311 of the light-emitting unit 31.

FIGS. 21 and 22 illustrate the sixteenth preferred embodiment of alight-emitting device 100 according to this invention. When compared tothe fifteenth preferred embodiment, the light-emitting device 100further includes a third light-transmissible substrate 93 disposed inthe accommodating space 10. The electrical contacts 301 and thelight-emitting chip 311 of the light-emitting unit 31 are mounted on thethird light-transmissible substrate 93.

FIGS. 23 and 24 illustrate the seventeenth preferred embodiment of alight-emitting device 100 according to this invention. When compared tothe fifteenth preferred embodiment, the light-emitting device 100 ofthis embodiment may be applied to replace a conventional screw-basedlight bulb. In particular, the thermally conductive bases 80 and thethermally conductive fin units 81 of the heat-dissipating unit 8 (seeFIG. 19) are dispensed with. The light-emitting device 100 furtherincludes a bulb housing 92 that encloses the first and secondlight-transmissible substrates 90, 91. The coupling unit 38 includes ascrew base 381 that is disposed externally of the bulb housing 1, thatencloses the ac-to-dc converter 37 and the second end portions 822 ofthe thermally conductive elements 82 of the heat-dissipating unit 8,that is connected electrically to the input side of the ac-to-dcconverter 37, and that is formed with an outer thread for threadedlyengaging the ac power source (AC) (see FIG. 19).

FIGS. 25 and 26 illustrate the eighteenth preferred embodiment of alight-emitting device 100 according to this invention. When compared tothe fifteenth preferred embodiment, the light-emitting device 100 ofthis embodiment may be applied to replace a conventional pin-basedfluorescent lamp. In particular, the leads 32 (see FIG. 19), and thefirst and second thermally conductive base 80 and the first and secondthermally conductive fin units 81 of the heat-dissipating unit 8 (seeFIG. 19) are dispensed with. The light-emitting device 100 furtherincludes a tubular housing 92 that encloses the first and secondlight-transmissible substrates 90, 91 and the ac-to-dc converter 37. Thefluorescent layer 4 is coated on an inner surface of the tubular housing92. Each of the electrical contacts 301 is mounted on and is connectedelectrically to the first end portion 821 of a respective one of thethermally conductive elements 82 of the heat-dissipating unit 8. Each ofthe conductive contacts 310 of the light-emitting chip 311 of thelight-emitting unit 31 is connected electrically to a respective one ofthe electrical contacts 301 through a respective one of electrical wires33. The output side of the ac-to-dc converter 37 is connectedelectrically to the first end portions 821 of the thermally conductiveelements 82 of the heat-dissipating unit 8. The second end portions 822of the thermally conductive elements 82 of the heat-dissipating unit 8extend externally of the tubular housing 92 through a first end 921 ofthe tubular housing 92. The coupling unit 38 includes a pair of pins 381that are connected electrically to the input side of the ac-to-dcconverter 37, that extends externally of the tubular housing 92 througha second end 922 of the tubular housing 92, and that is adapted to beconnected electrically to the ac power source (AC) (see FIG. 19).

FIGS. 27 and 28 illustrate the nineteenth preferred embodiment of alight-emitting device 100 according to this invention. When compared tothe fifteenth preferred embodiment, the leads 32 (see FIG. 19) aredispensed with. The light-emitting chip 311 of the light-emitting unit31 is mounted on the second transmissible substrate 91. Each of theelectrical contacts 301 is mounted on and is connected electrically tothe first end portion 821 of a respective one of the thermallyconductive element 82 of the heat-dissipating unit 8. Each of theconductive contacts 310 of the light-emitting chip 311 of thelight-emitting unit 31 is connected electrically to a respective one ofthe electrical contacts 301 through a respective one of the electricalwires 33. The output side of the ac-to-dc converter 37 is connectedelectrically to the second end portions 822 of the thermally conductiveelements 82 of the heat-dissipating unit 8. In this embodiment, each ofthe thermally conductive elements 82 of the heat-dissipating unit 8 hasa slanted surface 823 coated with a reflective layer 820 to therebyincrease reflective efficiency thereof.

FIGS. 29 and 30 illustrate the twentieth preferred embodiment of alight-emitting device 100 according to this invention. When compared tothe fifteenth preferred embodiment, the leads 32 (see FIG. 19) aredispensed with. The light-emitting chip 311 of the light-emitting unit31 is mounted on the second transmissible substrate 91. Thelight-emitting device 100 further includes a circuit board 5 thatextends into the accommodating space 10, and that is formed with firstand second electrical traces 51, 52. Each of the electrical contacts 301is formed on the circuit board 5, and connected electrically to arespective one of the electrical traces 51, 52. Each of the conductivecontacts 310 of the light-emitting chip 311 of the light-emitting unit31 is connected electrically to a respective one of the electricalcontacts 301 through a respective one of electrical wires 33. Theac-to-dc converter 37 is mounted on the circuit board 5. The output sideof the ac-to-dc converter 37 is connected electrically to the electricalcontacts 301 through the first and second electrical traces 51, 52. Thecoupling unit 38 is mounted on the circuit board 5, and coupledelectrically to the input side of the ac-to-dc converter 38. In thisembodiment, the circuit board 5 has a pair of slanted surfaces 53, eachof which is coated with a reflective layer 50 to thereby increasereflective efficiency thereof.

While the present invention has been described in connection with whatare considered the most practical and preferred embodiments, it isunderstood that this invention is not limited to the disclosedembodiments but is intended to cover various arrangements includedwithin the spirit and scope of the broadest interpretation so as toencompass all such modifications and equivalent arrangements.

1. A light-emitting device, comprising: a housing includingcomplementary first and second housing parts that cooperatively definean accommodating space therebetween; a light-emitting unit disposed insaid accommodating space in said housing, and including a light-emittingchip that has a plurality of conductive contacts; a cup-shaped reflectordisposed in said accommodating space in said housing and mounted on saidfirst housing part for reflecting light emitted from said light-emittingchip of said light-emitting unit toward said second housing part, saidcup-shaped reflector including a base wall that is formed with aplurality of holes therethrough, and a surrounding wall that divergesfrom said base wall thereof and that surrounds said light-emitting unit;and a plurality of leads, each of which extends into said accommodatingspace in said housing and is coupled electrically to a respective one ofsaid conductive contacts of said light-emitting chip of saidlight-emitting unit.
 2. The light-emitting device as claimed in claim 1,wherein said light-emitting chip of said light-emitting unit is one of alight-emitting diode chip, a laser diode chip, and a flip chip.
 3. Thelight-emitting device as claimed in claim 1, wherein said light-emittingchip of said light-emitting unit has a mounting surface that faces andextends parallel to said base wall of said cup-shaped reflector, saidconductive contacts of said light-emitting chip being mounted on saidmounting surface.
 4. The light-emitting device as claimed in claim 1,wherein said cup-shaped reflector has an inner surface coated with afluorescent layer.
 5. The light-emitting device as claimed in claim 4,wherein said fluorescent layer generates light of a wavelength in one ofranges from 400 nm to 470 nm, from 500 nm to 560 nm, from 600 nm to 620nm, and from 250 nm to 380 nm when excited by the light generated bysaid light-emitting chip of said light-emitting unit.
 6. Thelight-emitting device as claimed in claim 1, further comprising amounting unit disposed in said accommodating space in said housing, saidmounting unit including a light-transmissible substrate, saidlight-emitting chip of said light-emitting unit being mounted on saidlight-transmissible substrate, a plurality of electrical contactsmounted on said light-transmissible substrate, each of said leads beingconnected electrically and directly to a respective one of saidelectrical contacts, and a plurality of conductive wires, each of whichinterconnects a respective one of said electrical contacts to arespective one of said conductive contacts of said light-emitting chipof said light-emitting unit.
 7. The light-emitting device as claimed inclaim 6, wherein said light-transmissible substrate has a mountingsurface that faces and extends parallel to said base wall of saidcup-shaped reflector, said light-emitting unit and said electricalcontacts being mounted on said mounting surface of saidlight-transmissible substrate.
 8. The light-emitting device as claimedin claim 6, wherein each of said electrical contacts is made from one ofan indium tin oxide material and an indium zinc oxide material.
 9. Thelight-emitting device as claimed in claim 1, wherein said housing isgenerally spherical in shape.
 10. The light-emitting device as claimedin claim 1, wherein said housing is generally cylindrical in shape. 11.The light-emitting device as claimed in claim 1, wherein saidlight-emitting chip of said light-emitting unit emits one of a redlight, a green light, and a blue light.
 12. The light-emitting device asclaimed in claim 1, further comprising a non-conductive coolantcontained in said accommodating space in said housing.
 13. Thelight-emitting device as claimed in claim 12, further comprising afluorescent powder mixed with said non-conductive coolant.
 14. Thelight-emitting device as claimed in claim 6, wherein saidlight-transmissible substrate has a mounting surface that extendstransversely to said base wall of said cup-shaped reflector, saidlight-emitting unit and said electrical contacts being mounted on saidmounting surface of said light-transmissible substrate.
 15. Thelight-emitting device as claimed in claim 1, wherein said light-emittingchip of said light-emitting unit is a flip chip, has a mounting surfacethat faces and extends parallel to said base wall of said cup-shapedreflector, and includes a sapphire substrate mounted on said mountingsurface thereof.
 16. The light-emitting device as claimed in claim 1,wherein said light-emitting chip of said light-emitting unit is a flipchip, has a mounting surface that extends transversely to said base wallof said cup-shaped reflector, and includes a sapphire substrate mountedon said mounting surface of said light-emitting chip.
 17. Thelight-emitting device as claimed in claim 1, wherein said light-emittingunit includes a pair of said light-emitting chips, said cup-shapedreflector having an inner surface coated with first and secondfluorescent layers.
 18. The light-emitting device as claimed in claim17, wherein each of said first and second fluorescent layers generateslight of a wavelength in one of ranges from 400 nm to 470 nm, from 500nm to 560 nm, from 600 nm to 620 nm, and from 250 nm to 380 nm whenexcited by the light generated by said light-emitting chips of saidlight-emitting unit.
 19. The light-emitting device as claimed in claim6, wherein said light-transmissible substrate of said mounting unit hasopposite first and second mounting surfaces, said light-emitting unitincludes a pair of said light-emitting chips, each of which is mountedon a respective one of said first and second mounting surfaces of saidlight-transmissible substrate.
 20. The light-emitting device as claimedin claim 1, wherein each of said leads is connected electrically anddirectly to a respective one of said conductive contacts of saidlight-emitting chip of said light-emitting unit.
 21. The light-emittingdevice as claimed in claim 1, wherein said light-emitting chip has amounting surface that extends transversely to said base wall of saidcup-shaped reflector, said conductive contacts of said light-emittingchip being mounted on said mounting surface.
 22. The light-emittingdevice as claimed in claim 1, wherein said light-emitting unit includesa plurality of said light-emitting chips that are equiangularlydisplaced.
 23. The light-emitting device as claimed in claim 1, furthercomprising a heat-dissipating unit disposed externally of said housing,and including a thermally conductive base mounted on and in contact withsaid first housing part of said housing, and a plurality of thermallyconductive fins that extend from said thermally conductive base thereof.24. The light-emitting device as claimed in claim 1, further comprisinga heat-dissipating unit disposed externally of said housing, andincluding a thermally conductive base spaced apart from said housing, aplurality of thermally conductive fins that extend from said thermallyconductive base, and a thermally conductive element that extends fromsaid thermally conductive base thereof into said accommodating space insaid housing through said first housing part.
 25. A light-emittingdevice, comprising: first and second light-transmissible substratescooperatively defining an accommodating space; a plurality of electricalcontacts disposed in said accommodating space; a light-emitting unitdisposed in said accommodating space, and including a light-emittingchip that has a plurality of conductive contacts, each of which iscoupled electrically to a respective one of said electrical contacts; acoupling unit coupled electrically to said electrical contacts andadapted to be coupled electrically to a power source; and aheat-dissipating unit including a thermally conductive element, saidthermally conductive element having a first end portion that is disposedin said accommodating space, and a second end portion that extendsexternally of said accommodating space.
 26. The light-emitting device asclaimed in claim 25, wherein said light-emitting chip of saidlight-emitting unit is one of a light-emitting diode chip and a laserdiode chip.
 27. The light-emitting device as claimed in claim 25,wherein said first and second light-transmissible substrates are coatedwith a fluorescent layer.
 28. The light-emitting device as claimed inclaim 27, wherein said fluorescent layer generates light of a wavelengthin one of ranges from 400 nm to 470 nm, from 500 nm to 560 nm, from 600nm to 620 nm, and from 250 nm to 380 nm when excited by the lightgenerated by said light-emitting chip of said light-emitting unit. 29.The light-emitting device as claimed in claim 25, further comprising anon-conductive coolant contained in said accommodating space.
 30. Thelight-emitting device as claimed in claim 29, further comprising afluorescent powder mixed with said non-conductive coolant.
 31. Thelight-emitting device as claimed in claim 25, wherein each of saidelectrical contacts is made from one of an indium tin oxide material andan indium zinc oxide material.
 32. The light-emitting device as claimedin claim 25, wherein each of said light-emitting chips emits one of ared light, a green light, and a blue light.
 33. The light-emittingdevice as claimed in claim 25, wherein said electrical contacts and saidlight emitting unit are mounted on said first transmissible substrate.34. The light-emitting device as claimed in claim 25, wherein saidheat-dissipating unit further includes a thermally conductive basedisposed externally of said accommodating space, and a thermallyconductive fin unit that extends from said thermally conductive base,said second end portion of said thermally conductive element beingconnected to said thermally conductive base.
 35. The light-emittingdevice as claimed in claim 25, further comprising a plurality of leads,each of which extends into said accommodating space and is coupledelectrically to a respective one of said electrical contacts and arespective one of said conductive contacts of said light-emitting chipof said light-emitting unit, said coupling unit being coupledelectrically to said electrical contacts through said leads.
 36. Thelight-emitting device as claimed in claim 25, further comprising analternating current-to-direct current (ac-to-dc) converter having inputand output sides, said output side of said ac-to-dc converter beingcoupled electrically to said electrical contacts, said coupling unitbeing coupled electrically to input side of said ac-to-dc converter. 37.The light-emitting device as claimed in claim 25, further comprising athird light-transmissible substrate disposed in said accommodatingspace, said electrical contacts and said light-emitting unit beingmounted on said third light-transmissible substrate.
 38. Thelight-emitting device as claimed in claim 25, further comprising a bulbhousing enclosing said first and second light-transmissible substrates,said coupling unit including a screw base that is disposed externally ofsaid bulb housing, that encloses said second end portion of saidthermally conductive element, and that is coupled electrically to saidelectrical contacts.
 39. The light-emitting device as claimed in claim25, further comprising a tubular housing enclosing said first and secondlight-transmissible substrates, and having opposite first and secondends, said heat-dissipating unit including a plurality of said thermallyconductive elements, each of said electrical contacts being mounted onsaid first end portion of a respective one of said thermally conductiveelements of said light-emitting unit, said second end portion of each ofsaid thermally conductive elements of said light-emitting unit extendingexternally of said tubular housing through said first end of saidtubular housing, said coupling unit including a plurality of pins, eachof which extends into said tubular housing through said second end ofsaid tubular housing and is coupled electrically to a respective one ofsaid electrical contacts.
 40. The light-emitting device as claimed inclaim 25, wherein said heat-dissipating unit includes a plurality ofsaid thermally conductive elements, each of said electrical contactsbeing mounted on said first end portion of a respective one of saidthermally conductive elements of said heat-dissipating unit.
 41. Thelight-emitting device as claimed in claim 40, wherein each of saidthermally conductive elements of said heat-dissipating unit has aslanted surface coated with a reflective layer.
 42. The light-emittingdevice as claimed in claim 25, further comprising a circuit boardextending into said accommodating space and formed with a plurality ofelectrical traces, each of said electrical contacts being mounted onsaid circuit board and coupled electrically to a respective one of saidelectrical traces, said coupling unit being mounted on said circuitboard and coupled electrically to said electrical contacts through saidelectrical traces.
 43. The light-emitting device as claimed in claim 42,wherein said a circuit board has an inclined surface coated with areflective layer.